Low-power sensor interface integrated circuit design



To develop a low-power sensor interface integrated circuit to read out the data sensors developed through project 9 and project 10 and to drive the micoactuators in project 8 . To save power in CMOS technology, al low supply voltage is needed, which calls for time -based design solutions. Therefore, digitally dominant analog design techniques and time-based processing will be explored to obtain an optimal circuit architecture that has state -of-the-art figure-of -merit performance. The architectural study will be followed by the actual design, fabrication, testing and validation of a sensor readout integrated circuit. Further, the test chips will be thinned down to about 15 mm in post -processing steps during secondments. The bendability of these ultra-thin chips (UTCs) will lead to improved conformability.

Expected Results

Low-power electronics interface to read the data from sensors in the skin.

Planned secondments

FBK: to define readout specifications

IMEC: to attend courses on microelectronics

UoG: to learn about thinning of Si chips


Host institution The Katholieke Universiteit Leuven

Enrolments (in Doctoral degree) The Katholieke Universiteit Leuven


Georges Gielen, Chris Van Hoof

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This project is founded by the EU Horizon 2020 research and innovation programme under grant agreement No 861166 (INTUITIVE)