To develop a low-power sensor interface integrated circuit to read out the data sensors developed through project 9 and project 10 and to drive the micoactuators in project 8 . To save power in CMOS technology, al low supply voltage is needed, which calls for time -based design solutions. Therefore, digitally dominant analog design techniques and time-based processing will be explored to obtain an optimal circuit architecture that has state -of-the-art figure-of -merit performance. The architectural study will be followed by the actual design, fabrication, testing and validation of a sensor readout integrated circuit. Further, the test chips will be thinned down to about 15 mm in post -processing steps during secondments. The bendability of these ultra-thin chips (UTCs) will lead to improved conformability.
Low-power electronics interface to read the data from sensors in the skin.
FBK: to define readout specifications
IMEC: to attend courses on microelectronics
UoG: to learn about thinning of Si chips
Host institution The Katholieke Universiteit Leuven
Enrolments (in Doctoral degree) The Katholieke Universiteit Leuven
Georges Gielen, Chris Van Hoof
Link to application will come shortly
This project is founded by the EU Horizon 2020 research and innovation programme under grant agreement No 861166 (INTUITIVE)