To investigate various methods for integration of sensing/electronic components, developed through research themes 8-11 on soft substrates. The focus will be on soldering techniques and stretchable connections to obtain tactile skin with reliable operation, while allowing normal working of sensors and other electronics embedded in the soft substrates. Where possible the tools developed for integration of planar electronics will be used.
Method for integrating/embedding sensors and electronics in soft materials as in skin.
BMW: to learn integration of skin concepts in cars
IMEC: to learn about integration on wearbles
KIT: to validate skin for rehabilitation
Host institution: University of Glasgow
Enrolments (in Doctoral degree): University of Glasgow
Ravinder Dahiya, Leandro Lorenzelli
This project is founded by the EU Horizon 2020 research and innovation programme under grant agreement No 861166 (INTUITIVE)