Integration on soft substrates



To investigate various methods for integration of sensing/electronic components, developed through research themes 8-11 on soft substrates. The focus will be on soldering techniques and stretchable connections to obtain tactile skin with reliable operation, while allowing normal working of sensors and other electronics embedded in the soft substrates. Where possible the tools developed for integration of planar electronics will be used.

Expected Results

Method for integrating/embedding sensors and electronics in soft materials as in skin.

Planned secondments

BMW: to learn integration of skin concepts in cars

IMEC: to learn about integration on wearbles

KIT: to validate skin for rehabilitation


Host institution: University of Glasgow

Enrolments (in Doctoral degree): University of Glasgow


Ravinder Dahiya, Leandro Lorenzelli