Low-power sensor interface integrated circuit design
To develop a low-power sensor interface integrated circuit to read out the data sensors developed through project 9 and project 10 and to drive the micoactuators in project 8 . To save power in CMOS technology, al low supply voltage is needed, which calls for time -based design solutions. Therefore, digitally dominant analog design techniques and time-based processing will be explored to obtain an optimal circuit architecture that has state -of-the-art figure-of -merit performance. The architectural study will be followed by the actual design, fabrication, testing and validation of a sensor readout integrated circuit. Further, the test chips will be thinned down to about 15 mm in post -processing steps during secondments. The bendability of these ultra-thin chips (UTCs) will lead to improved conformability.
Low-power electronics interface to read the data from sensors in the skin.
FBK: to define readout specifications
IMEC: to attend courses on microelectronics
UoG: to learn about thinning of Si chips
Host institution The Katholieke Universiteit Leuven
Enrolments (in Doctoral degree) The Katholieke Universiteit Leuven
Georges Gielen, Chris Van Hoof